Electronic Component Reliability: Fundamentals, Modelling, Evaluation, and AssuranceThis book includes an introduction to some important reliability concepts and a review of terminology. The work is divided into three sections: modelling, evaluation and assurance. |
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Page 39
... electro- migration failures were a concern only of high current ECL technologies , but the downscaling of geometries in VLSI has brought electromigration pro- blems also to the large family of CMOS circuits . Electromigration can only ...
... electro- migration failures were a concern only of high current ECL technologies , but the downscaling of geometries in VLSI has brought electromigration pro- blems also to the large family of CMOS circuits . Electromigration can only ...
Page 40
... electromigration should not be a major problem . In fact , very few field failures have been reported due to electromigration ( Denson and Brusius , 1989 ) , and most of the electromigration studies have been based on specially ...
... electromigration should not be a major problem . In fact , very few field failures have been reported due to electromigration ( Denson and Brusius , 1989 ) , and most of the electromigration studies have been based on specially ...
Page 42
... electromigration related compo- nent respectively . The breakdown energy of metal method or BEM method ( Hong and Crook , 1985 ) , the standard wafer - level electromigration test or SWEAT ( Root and Turner , 1985 ) , and the wafer ...
... electromigration related compo- nent respectively . The breakdown energy of metal method or BEM method ( Hong and Crook , 1985 ) , the standard wafer - level electromigration test or SWEAT ( Root and Turner , 1985 ) , and the wafer ...
Contents
Reliability Physics and Failure Mechanisms | 21 |
3 | 28 |
References | 55 |
Copyright | |
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accelerated lifetests activation energy analysis Arrhenius Arrhenius equation batch breakdown burn-in causes Chapter CMOS component failure component lifetime component strength computed constant hazard rate corrosion cracking cumulative curve described devices discussed electromigration electronic components electrostatic discharge evaluation example exponential distribution extrinsic failures Failure intensity failure pattern field failures freak loads illustrated infant mortality infant mortality failures integrated circuits Intel Corporation intrinsic component reliability intrinsic reliability lifetime distribution lifetime patterns loading conditions log-normal distribution long-term wearout macro defects manufacturing median lifetime mixed distribution nent normal distribution number of failures oxide physics-of-failure plastic package population probability density function problem Quality and Reliability relia Reliability Engineering Reliability Engineering International reliability prediction sample screening shown in Figure situation socket statistical step-stress test strength deterioration strength distribution stress subpopulation Table technique temperature thermal tion transistor two-fold mixed voltage Weibull distribution Weibull plot wire bond