Epoxy Adhesive Formulations

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McGraw Hill Professional, Sep 30, 2005 - Technology & Engineering - 535 pages
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Unmodified, epoxy resins cause certain problems for both the adhesive formulator and end-user. They are often rigid and brittle; hence, impact resistance and peel strength are poor. For decades, Chemist have been vigorously working to minimize these major shortcomings. Based on a popular course sponsored by the Society of Plastics Engineers and written by an authority in the field, this comprehensive text presents a variety of methods to accomplish what up to now has been a formidable task. Beginning with epoxy chemistry, moving on to fillers, filler treatments, and surfactants, and ending with current and future development in formulating Epoxy Adhesives, this rigorous text addressed the problem of improving flexibility, durability and strength by adding chemical groups to the epoxy structure either via the base resin or the curing agent or by adding separate flexibilizing resins to the formulation to create an epoxy-hybrid adhesive.

 

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Contents

Chapter 1 Epoxy Adhesives
1
Chapter 2 Epoxy Resin Chemistry
27
Chapter 3 Important Properties of Epoxy Adhesives
43
Chapter 4 Epoxy Resins
71
Chapter 5 Epoxy Curing Agents and Catalysts
85
Chapter 6 Solvents and Diluents
111
Chapter 7 Hybrid Resins
123
Chapter 8 Flexibilizers and Tougheners
137
Chapter 16 Epoxy Adhesives on Selected Substrates
343
Chapter 17 Processing of Epoxy Adhesives
391
Chapter 18 Health and Safety Issues
413
Chapter 19 Quality Control and Specifications
425
Chapter 20 Testing
437
Epoxy Adhesives Epoxy Resins Curing Agents and Catalysts Additives and Modifiers
461
Appendix B Properties of Selected Commercial Epoxy Adhesive Formulations
467
Appendix C Selected Epoxy Resins
473

Chapter 9 Fillers and Extenders
155
Chapter 10 Adhesion Promoters and Primers
185
Chapter 11 Room Temperature Curing Epoxy Adhesives
203
Chapter 12 ElevatedTemperature Curing Liquid and Paste Epoxy Adhesives
227
Chapter 13 Solid Epoxy Adhesive Systems
243
Chapter 14 Unconventional Epoxy Adhesives
255
Chapter 15 Effect of the Service Environment
291
Appendix D Epoxy Curing Agents
479
Appendix E Index to Formulations
485
Appendix F Surface Preparation Methods for Common Substrate Materials
487
Appendix G Specifications and Standards
511
Appendix H Conversion Factors
525
Index
527
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About the author (2005)

Edward Petrie has been active in the adhesives industry for over 35 years -- both in the formulation side and the end-use sides of the industry. He has a BS (Chemical Engineering) and MS (Polymer Science) degrees from Carnegie Mellon University and an MBA from Duquesne University. Throughout his 35 years in the industry.

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